A single chip inverter IPM ,M81500FP, has been manufactured using a SOI process by Mitsubishi Electric. The IPM consists of lateral IGBTs, FwDi’s, HVIC-, control and protection functionality all implemented on a single chip. The M81500FP is protected against under voltage, short circuit and over temperature. By PCB cooling and surface contact cooling an output power of 100W can be achieved easily.
The newly designed SMD package IPM requires only 11,93x17,50mm of PCB surface which is only 45% of that of a competing discrete solution using DPAK Transistors and SO-8 HVICs.
An evaluation board for the M81500FP has been made and all functions were verified using this hardware platform.
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