Mitsubishi Electric developed the new RC-IGBT technology in which  the anti-parallel combination of IGBT and FWD monolithically integrated on one chip. The silicon area needed for the same performance with seperated IGBT and FWD is reduced approximately 33%.

By virtue of integrating the RC-IGBT technology with protection functions and drivers in a Super MINI DIP package (38x24mm) Mitsubishi Electric created their new super MINI-DIP IPM family having ratings from 3A/600V to 20A/600V with 1500Vrms isolation voltage.

The new package has a superior thermal performance, large clearance and creepage distances and allows simple PCB routing.